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学科主题: 高分子化学
题名: Postpolymerization of a Fluorinated and Reactive Poly(aryl ether): An Efficient Way To Balance the Solubility and Solvent Resistance of the Polymer
其他题名: Postpolymerization of a Fluorinated and Reactive Poly(aryl ether): An Efficient Way To Balance the Solubility and Solvent Resistance of the Polymer
作者: Tian S(田松)1; Sun J(孙晶)1; Jin KK(金凯凯)1; Wang JJ(王佳佳)1; He FK(贺凤开)1; Zheng SJ(郑世军)1; Fang Q(房强)1
通讯作者: 郑世军 ; 房强
刊名: ACS Appl. Mater. Interfaces
发表日期: 2014
DOI: 10.1021/am506019s
卷: 6, 期:22, 页:20437-20443
收录类别: SCI
英文摘要: A new fluorinated poly(aryl ether) with reactive benzocyclobutene groups as the side chain was successfully synthesized. This polymer showed a number-average molecular weight (M-n) of 200 000 and had good solubility and film-forming ability. After being postpolymerized at high temperature (>200 degrees C), the polymer film converted to a cross-linked network structure, which was insoluble in the common organic solvents. Such results suggest that the postpolymerization is an efficient way to achive the balance between the solubility and the solvent resistance of the polymer. TGA data showed that the postpolymerized polymer had a 5 wt % loss temperature at 495 degrees C and a residual of 61% at 1000 degrees C under N-2. The cross-linked film also exhibited good dielectric properties with an average dielectric constant of about 2.62 in a range of frequencies from 1 to 30 MHz. With regard to the mechanical properties, the cross-linked film had hardness, Young's modulus, and bonding strength to a silicon wafer of 1.22, 8.8, and 0.89 GPa, respectively. These data imply that this new polymer may have potential applications in the electrical and microelectronics industry.
语种: 英语
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内容类型: 期刊论文
URI标识: http://ir.sioc.ac.cn/handle/331003/38916
Appears in Collections:高分子材料研究室_期刊论文

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作者单位: 1.中科院上海有机化学研究所
2.郑州大学

Recommended Citation:
Tian S,Sun J,Jin KK,et al. Postpolymerization of a Fluorinated and Reactive Poly(aryl ether): An Efficient Way To Balance the Solubility and Solvent Resistance of the Polymer[J]. ACS Appl. Mater. Interfaces,2014,6(22):20437-20443.
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