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Benzocyclobutene resin with fluorene backbone: a novel thermosetting material with high thermostability and low dielectric constant
Alternative TitleBenzocyclobutene resin with fluorene backbone: a novel thermosetting material with high thermostability and low dielectric constant
Wang YQ(王元强)1; Sun J(孙晶)1; Jin KK(金凯凯)1; Wang JJ(王佳佳)1; Yuan C(袁超)1; Tong JW(童佳伟)1; Diao S(刁屾)1; He FK(贺凤开)1; Fang Q(房强)1
2014
Source PublicationRSC Adv.
Volume4Issue:75Pages:39884-39888
AbstractA fluorene-based monomer (FB) with thermally cross-linkable benzocyclobutene groups is reported here. This monomer showed good solubility in the common organic solvents and had a low melting point (128 degrees C). When being treated at high temperature (>200 degrees C), the monomer was converted to a crosslinked network structure (PFB). TGA data exhibited that PFB had high thermostability with a 5% weight loss temperature of 437 degrees C and 372 degrees C in N-2 and air, respectively. Moreover, PFB showed a char yield of 47.6% at 1000 degrees C in N-2. With regard to the electrical properties, PFB indicated an average of dielectric constants of about 2.7 ranging from 0.15 MHz to 30 MHz. All these results suggest that FB could be used as the varnish for insulating enameled wire in the electrical industry, and as encapsulation resins in the microelectronics industry.
Subject Area高分子化学
DOI10.1039/c4ra05898d
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Indexed BySCI
Language英语
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Cited Times:15[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.sioc.ac.cn/handle/331003/38904
Collection高分子材料研究室
Corresponding AuthorDiao S(刁屾); Fang Q(房强)
Affiliation1.中科院上海有机化学研究所
2.烟台大学
Recommended Citation
GB/T 7714
Wang YQ,Sun J,Jin KK,et al. Benzocyclobutene resin with fluorene backbone: a novel thermosetting material with high thermostability and low dielectric constant[J]. RSC Adv.,2014,4(75):39884-39888.
APA 王元强.,孙晶.,金凯凯.,王佳佳.,袁超.,...&房强.(2014).Benzocyclobutene resin with fluorene backbone: a novel thermosetting material with high thermostability and low dielectric constant.RSC Adv.,4(75),39884-39888.
MLA 王元强,et al."Benzocyclobutene resin with fluorene backbone: a novel thermosetting material with high thermostability and low dielectric constant".RSC Adv. 4.75(2014):39884-39888.
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