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学科主题: 高分子化学
题名: Benzocyclobutene resin with fluorene backbone: a novel thermosetting material with high thermostability and low dielectric constant
其他题名: Benzocyclobutene resin with fluorene backbone: a novel thermosetting material with high thermostability and low dielectric constant
作者: Wang YQ(王元强)1; Sun J(孙晶)1; Jin KK(金凯凯)1; Wang JJ(王佳佳)1; Yuan C(袁超)1; Tong JW(童佳伟)1; Diao S(刁屾)1; He FK(贺凤开)1; Fang Q(房强)1
通讯作者: 刁屾 ; 房强
刊名: RSC Adv.
发表日期: 2014
DOI: 10.1039/c4ra05898d
卷: 4, 期:75, 页:39884-39888
收录类别: SCI
英文摘要: A fluorene-based monomer (FB) with thermally cross-linkable benzocyclobutene groups is reported here. This monomer showed good solubility in the common organic solvents and had a low melting point (128 degrees C). When being treated at high temperature (>200 degrees C), the monomer was converted to a crosslinked network structure (PFB). TGA data exhibited that PFB had high thermostability with a 5% weight loss temperature of 437 degrees C and 372 degrees C in N-2 and air, respectively. Moreover, PFB showed a char yield of 47.6% at 1000 degrees C in N-2. With regard to the electrical properties, PFB indicated an average of dielectric constants of about 2.7 ranging from 0.15 MHz to 30 MHz. All these results suggest that FB could be used as the varnish for insulating enameled wire in the electrical industry, and as encapsulation resins in the microelectronics industry.
语种: 英语
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内容类型: 期刊论文
URI标识: http://ir.sioc.ac.cn/handle/331003/38904
Appears in Collections:高分子材料研究室_期刊论文

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作者单位: 1.中科院上海有机化学研究所
2.烟台大学

Recommended Citation:
Wang YQ,Sun J,Jin KK,et al. Benzocyclobutene resin with fluorene backbone: a novel thermosetting material with high thermostability and low dielectric constant[J]. RSC Adv.,2014,4(75):39884-39888.
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